HighCurrent PCBs often tend to act as heat sources due to Thermal cycling phenomenon. Such complex phenomenon can be modeled by intercoupling Ansys EM and Thermal simulations and analyse the Joule heating on Power lines of PCBs.
High power Circuits often generate more heat and tend to undergo deformation due to thermal stresses Such deformation could lead to deviation in performance. Such complex Multiphysics phenomenon is modeled accurately by inter coupling EM , Thermal and Mechanical Ansys tools.
Ansys enables user to design Antennas and Antenna Arrays and analyse its performance with high accuracy and several optimization algorithms to arrive at the design requirements.
High Speed PCBs are often tend to have several Signal integrity issues which are accurately analysed through ansys in both time and frequency domain and also spacial visualization of fields yields rich understanding of the design and optimize it as per requirements
All Electronics radiate and susceptible to noise and such noise are modeled with high accuracy using ansys enabling the full 3D modeling of design and visualize the fields at different locations to identify the potential noise sources, apply mitigation mechanisms and verification.
